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PreMaster Programm im Bereich Digitalisierung SiC Wafering (m/w/div)
About this role
Bosch Group is hiring for a PreMaster Programm im Bereich Digitalisierung SiC Wafering (m/w/div) role in Reutlingen, Germany (On-site, Full-Time).
Industry Standard Pay for this role: $95,000 to $135,000 USD/year (calibrated to regional Glassdoor market benchmarks).
Review complete role requirements and apply directly via the verified company portal.