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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
About this role
Renesas Electronics is hiring for a (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried) role in Taipei, Taiwan (On-site, Full-Time).
Industry Standard Pay for this role: $150,000 to $210,000 USD/year (calibrated to regional Glassdoor market benchmarks).
Review complete role requirements and apply directly via the verified company portal.